this specification documents the detailed requirements for analog devices space qualified die including die qualification as described for class k in mil - prf - 38534, appendix c, table c - ii except as modified herein. the manufacturing flow descr ibed in the standard die products program brochure at http://www.analog.com/marketsolutions/militaryaerospace/pdf/die_broc.pdf is to be considered a part of this spec ification. this data sheet specifically details the space grade version of this product. a more detailed operational description and a complete data sheet for commercial product grades can be found at www.anal og.com/ad670 the complete part number(s) of this specification follow: part number description ad670 - 000c 8 - bit low cost signal conditioning adc 1. d0 (lsb) 2. d1 3. d2 4. d3 5. d4 6. d5 7. d6 8. d7 (msb) 9. status 10. power ground 11. bpo/upo* 12. format 13. r/w* 14. ce* 15. cs* 16. - vin hi * = active low 17. - vin low 18. +vin hi 1 9. +vin low 20. +vcc
ad 670 1/ v cc to ground .................................................................. 0v to +7.5v digital inputs (pin 11 C 15) .............................. ................ - 0.5v to v cc +0.5v digital outputs (pin 1 C 9) .............................. ... ................ momentary short to v cc or ground analog inputs (pin 16 C 19) ............................................. 30v storage temperature range .......................................... - 65 c to +150 c junction temperature (t j ) .. ..+150c operating temperature range ......................................... - 55 c to +125 c absolute maximum ratings notes: 1./ stresses above t he absolute maximum rating may cause p ermanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability. in accordance with class - k version of mil - prf - 38534, appendix c, table c - ii, except as modified herein. (a) qual samples size and qual acceptance criteria C 25/2 (b) qual sample package C dip (c) pre - screen electrical test over temperature performed post - assembly prior to die qualification . table i notes: 1 / v cc = +5v, t a = 25 c, unless otherwise specified. 2 / tested on both 2.55v full scale and - 1.28v to 1.27v full sc ale. 3 / minimum resolution for which there are no missing codes. 4 / parameter is tested at v cc = +5v, but is guaranteed from v cc = 4.5v to v cc = 5.5v.
ad670 table ii notes: 1 / v cc = +5v, unless otherwise specifi ed. 2 / tested on both 2.55v full scale and - 1.28v to 1.27v full scale. 3 / minimum resolution for which there are no missing codes. 4 / parameter is tested at v cc = +5v, but is guaranteed from v cc = 4.5v to v cc = 5.5v.
ad 670 5.1 htrb is not applicable for this drawing. 5.2 burn - in is per mil - std - 883 method 1015 test condition b or c. 5.3 steady state life test is per mil - std - 883 method 1005.
ad670
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